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Enhancement of heat dissipation in an electronic chip cooling system using graphite fins

Author

Listed:
  • Xue, Dong
  • Wu, Long
  • Xun, Lian

Abstract

As electronic devices get smaller, cooling systems with higher thermal efficiency is demanding by fast growing electronic industry. Great amount of research has been performed on the cooling systems but research on the materials of the cooling systems needs more work. Graphite with high thermal conductivity and light weight is a great candidate to be used in electronic devices. The bottleneck of using graphene in the cooling systems is the thermal transport among the interface from the substrate to the graphene fin system. In this research finite element simulation of graphite fin cooling system has been investigated to study the effect of different applied pressure on the cooling system performance. Study of this cooling system showed good improvement in comparison with common copper fin cooling systems.

Suggested Citation

  • Xue, Dong & Wu, Long & Xun, Lian, 2017. "Enhancement of heat dissipation in an electronic chip cooling system using graphite fins," MPRA Paper 80061, University Library of Munich, Germany, revised 28 Jun 2017.
    • Handle: RePEc:pra:mprapa:80061
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    More about this item

    Keywords

    Tesla microvalve; diodicity; pressure field; velocity field; thermal management;
    All these keywords.

    JEL classification:

    • I0 - Health, Education, and Welfare - - General

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