IDEAS home Printed from https://ideas.repec.org/a/zib/zjmerd/v42y2019i3p102-105.html
   My bibliography  Save this article

Influence Of Heat Treatment And Deformation On The Microstructure And Mechanical Properties Cu-Ni-Sn Alloy

Author

Listed:
  • Nguyen Duong Nam

    (Vietnam Maritime University, Haiphong city, Vietnam)

Abstract

This article present about studying on effect heat treatment and strain on mechanical properties of Cu-7Ni-7Sn alloy. This alloy is high elasticity alloy, advance characteristics of this alloy can obtain when associate heat treatment and deformation. The article ejected advance heat treatment and deformation behavior for its. Before processing hardness, strength, the elastic limit of this alloy have a small value. The hardness obtains about 90 – 95HB; the strength obtains about 200MPa; the elastic limit obtain about 100MPa.After heat treatment and deformation, hardness, strength, elastic limit of alloy ascend to multiple; the hardness obtains 294 – 302HB; the strength obtains 1000MPa; the elastic limit obtains 600 – 700MPa. This fact could explain by two mechanisms: deformation mechanism and spinodal transition. Deformation mechanism is to pull small grain lichen, increasing the strength of this alloy. Spinodal decomposition is a mechanism by which a solution of two or more components can separate into distinct regions (or phases) with distinctly different chemical compositions and physical properties. This mechanism differs from classical nucleation in that phase separation due to spinodal decomposition is much more subtle, and occurs uniformly throughout the material not just at discrete nucleation sites. The fineness of spinodal structures is characterized by the distance between regions of identical composition, which is of the order of 50 to 1000 Ao.

Suggested Citation

  • Nguyen Duong Nam, 2019. "Influence Of Heat Treatment And Deformation On The Microstructure And Mechanical Properties Cu-Ni-Sn Alloy," Journal of Mechanical Engineering Research & Developments (JMERD), Zibeline International Publishing, vol. 42(3), pages 102-105, May.
    • Handle: RePEc:zib:zjmerd:v:42:y:2019:i:3:p:102-105
    DOI: 10.26480/jmerd.03.2019.102.105
    as

    Download full text from publisher

    File URL: https://jmerd.org.my/download/3139/
    Download Restriction: no
    File URL: https://libkey.io/10.26480/jmerd.03.2019.102.105?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:zib:zjmerd:v:42:y:2019:i:3:p:102-105. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Zibeline International Publishing (email available below). General contact details of provider: https://jmerd.org.my/ .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.