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Tribology Interface Over Digital Technologies And Envisaging Tribology With Patent Landscapeâ €” A Queer Review

Author

Listed:
  • V. RAJAKUMARESWARAN

    (Department of Computer Science and Design, Erode Sengunthar Engineering College, Thuduppathi, Tamil Nadu, India)

  • NARENDER CHINTHAMU

    (��Enterprise Architect, MIT CTO Candidate, India)

  • M. MURALI

    (��Department of IT, Sona College of Technology, Salem, Tamil Nadu, India)

  • BALAJI DEVARAJAN

    (�Department of Mechanical Engineering, KPR Institute of Engineering and Technology, Coimbatore, Tamil Nadu, India)

Abstract

Digital technologies sustain today’s world. Every part of the world is working towards digital technologies, which none of us can eliminate. Enormous growth is achieved only by unexpected acceleration by digital technologies, including the Internet of Everything (IoE), Artificial Neural Networks (ANN), Machine Learning (ML), Internet of Things (IoT), Artificial Intelligence (AI), Deep Learning (DL), and many more. These technologies started occupying all the engineering sectors, including manufacturing. This paper focuses on tribology analysis related to manufacturing concerning various digital manufacturing technologies. The paper narration includes Tribology using digital technologies wherein the journals and patent landscape analysis abet them. In trend, Tribology utilizes all these technologies today and envisages its growth with the predominant technological invention in the border view. The survey of various literature reveals that only three digital technologies, including AI, ML, and ANN, are used by tribologists around the globe. Other Technologies like Evolutionary Algorithm (EA), Support Vector Machine (SVM), and Adaptive Neuro-Fuzzy Interference Systems (ANFIS) are not used predominantly.

Suggested Citation

  • V. Rajakumareswaran & Narender Chinthamu & M. Murali & Balaji Devarajan, 2024. "Tribology Interface Over Digital Technologies And Envisaging Tribology With Patent Landscapeâ €” A Queer Review," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 31(07), pages 1-20, July.
    • Handle: RePEc:wsi:srlxxx:v:31:y:2024:i:07:n:s0218625x24300077
    DOI: 10.1142/S0218625X24300077
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