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EFFECTS OF PARTICLE SIZE AND SINTERING TEMPERATURE ON SUPERELASTICITY BEHAVIOR OF NiTi SHAPE MEMORY ALLOY USING NANOINDENTATION

Author

Listed:
  • C. VELMURUGAN

    (Department of Mechanical Engineering, Indian Institute of Information Technology, Tiruchirappalli, Tamil Nadu 620009, India)

  • V. SENTHILKUMAR

    (#x2020;Department of Production Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu 620015, India)

Abstract

The present study investigates the superelasticity properties of spark plasma sintered (SPS) nickel titanium shape memory alloy (NiTi SMA) with the influence of sintering temperature and particle size. The nanoindentation is conducted on the surface of the NiTi SMA at various loads such as 100, 300 and 500mN. The nanoindentation technique determines the quantitative results of elasto-plastic properties such as depth recovery in the form of superelasticity, stiffness, hardness and work recovery ratio from load–depth (P–h) data during loading and unloading of the indenter. Experimental findings show that the depth and work recovery ratio increases with the decrease of indentation load and particle size. In contrast, increasing the sintering temperature exhibited a better depth and work recovery due to the removal of pores which could enhance the reverse transformation. The contact stiffness is influenced by dp∕dh which leads to attain a maximum stiffness at the highest load (500mN) and particle size (45μm) along with the lowest sintering temperature (700∘C). NiTi alloy exhibited a maximum hardness of 9.46GPa when subjected to indent at the lowest load and particle size sintered at 800∘C. The present study reveals a better superelastic behavior in NiTi SMA by reducing the particle size and indentation load associated with the enhancement of sintering temperature.

Suggested Citation

  • C. Velmurugan & V. Senthilkumar, 2021. "EFFECTS OF PARTICLE SIZE AND SINTERING TEMPERATURE ON SUPERELASTICITY BEHAVIOR OF NiTi SHAPE MEMORY ALLOY USING NANOINDENTATION," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 28(05), pages 1-11, May.
    • Handle: RePEc:wsi:srlxxx:v:28:y:2021:i:05:n:s0218625x21500244
    DOI: 10.1142/S0218625X21500244
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