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Cu–W FILM STRUCTURE INFLUENCED BY Ar+ ENERGY AND LOW-ENERGY BEAM FLOW BOMBARD DURING PREPARATION BY TWO-ION-BEAM SPUTTERING

Author

Listed:
  • YONG-PING AI

    (New Low-Carbon Green Building Materials Institute, Electromechanical Engineering College, Jinggangshan University, Ji’an, Jiangxi 343009, P. R. China)

  • SHI-KUN XIE

    (New Low-Carbon Green Building Materials Institute, Electromechanical Engineering College, Jinggangshan University, Ji’an, Jiangxi 343009, P. R. China)

Abstract

The influences of Ar+ energy and low-energy sputtering on the structure of Cu–W thin film prepared by double-ion-beam sputtering are studied. Results show that the Cu–W thin film sputtered by ion beam onto a Cu substrate is in the form of an amorphous tungsten framework mechanically mixed with Cu grains when the Cu-target Ar+ energy is within 1–2keV and the W-target Ar+ energy is 3keV. The Cu grain size increases slightly, increasing the Cu-target Ar+ energy. When the Ar+ energy increases to the critical value (≈1.5keV), a small amount of Cu is transformed into a single crystal, forming a solid solution with the melting of W. Due to crystal defects and lattice distortion, there is a small shift in the Cu diffraction peak.

Suggested Citation

  • Yong-Ping Ai & Shi-Kun Xie, 2020. "Cu–W FILM STRUCTURE INFLUENCED BY Ar+ ENERGY AND LOW-ENERGY BEAM FLOW BOMBARD DURING PREPARATION BY TWO-ION-BEAM SPUTTERING," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 27(11), pages 1-5, November.
  • Handle: RePEc:wsi:srlxxx:v:27:y:2020:i:11:n:s0218625x2050002x
    DOI: 10.1142/S0218625X2050002X
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