IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v26y2019i09ns0218625x19500550.html
   My bibliography  Save this article

PREPARATION OF Cu-SiO2/PA12 COMPOSITE POWDERS BY ELECTROLESS PLATING FOR USE IN SLS PROCESSING

Author

Listed:
  • CHENGMEI GUI

    (School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, Anhui 23009, P. R. China)

  • ZHENMING CHEN

    (#x2020;Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization, College of Materials and Environmental Engineering, Hezhou University, Hezhou, Guangxi 542899, P. R. China)

  • CHENGUANG YAO

    (#x2021;Shanghai Genius Advanced Material Co., Ltd, Shanghai 201109, P. R. China)

  • GUISHENG YANG

    (School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, Anhui 23009, P. R. China‡Shanghai Genius Advanced Material Co., Ltd, Shanghai 201109, P. R. China§Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, P. R. China)

Abstract

In this work, SiO2-encapsulated copper particles/PA12 (Cu-SiO2/PA12) composite powders were prepared by electroless composite plating, and the laser sintering behavior was investigated. Results showed that Cu, Cu2O, CuO, and SiO2 (Cu-SiO2) composite particles were plated on the surface of KH550-modified PA12 powders. The Cu-SiO2 particles existed independently on PA12 surface, and the size was around 200 nm. The melting temperature and crystallization temperature of Cu-SiO2/PA12 composite powders were 183∘C and 150∘C. The results indicate that the selective laser sintering (SLS) process involved the contact of Cu-SiO2/PA12 powders, the formation of sintering neck, the growth of sintering neck, and the formation of fused solid. The Cu-SiO2 composite particles uniformly dispersed in the part due to surface tension, and the contact interface was good due to their similar polarity. The Cu-SiO2/PA12 SLS parts had excellent dimensional precision. The tensile strength of the 15W-sintered Cu-SiO2/PA12 specimen was 48MPa.

Suggested Citation

  • Chengmei Gui & Zhenming Chen & Chenguang Yao & Guisheng Yang, 2019. "PREPARATION OF Cu-SiO2/PA12 COMPOSITE POWDERS BY ELECTROLESS PLATING FOR USE IN SLS PROCESSING," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 26(09), pages 1-8, November.
    • Handle: RePEc:wsi:srlxxx:v:26:y:2019:i:09:n:s0218625x19500550
    DOI: 10.1142/S0218625X19500550
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X19500550
    Download Restriction: Access to full text is restricted to subscribers
    File URL: https://libkey.io/10.1142/S0218625X19500550?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:26:y:2019:i:09:n:s0218625x19500550. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.