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A NOVEL PREPARATION ROUTE FOR ELECTROLESS COPPER PLATING ON SURFACE OF CaCO3 POWDERS

Author

Listed:
  • ZHENMING CHEN

    (Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive, Utilization College of Materials & Environmental Engineering, Hezhou University, Hezhou Ctiy 542899, P. R. China)

  • SHOUFA ZHOU

    (#x2020;Hefei Lucky & Technology Industry Co. Ltd, Hefei City 230041, P. R. China)

  • YAJUN ZHANG

    (#x2021;Department of Chemical and Materials Engineering, Hefei University, Hefei City 230601, P. R. China)

  • MENGRU HUANG

    (#x2021;Department of Chemical and Materials Engineering, Hefei University, Hefei City 230601, P. R. China)

  • LE WAN

    (#x2021;Department of Chemical and Materials Engineering, Hefei University, Hefei City 230601, P. R. China)

  • YANG LI

    (#x2021;Department of Chemical and Materials Engineering, Hefei University, Hefei City 230601, P. R. China)

  • JUNJUN HUANG

    (#x2020;Hefei Lucky & Technology Industry Co. Ltd, Hefei City 230041, P. R. China‡Department of Chemical and Materials Engineering, Hefei University, Hefei City 230601, P. R. China)

Abstract

In this work, electroless copper plating on the surface of CaCO3 powders modified with hydrophobic and hydrophilic coating was developed in that order. It was found that the surface structure of modified CaCO3 powders could absorb Sn2+ and then reduce Ag+. The Ag atoms were used as catalysts for the electroless face-centered copper crystallites plating on the CaCO3 surface. The compact and uniform copper particles were plated on the CaCO3 surface. The plated coating has a two-layer structure. The size of copper particles in the first layer was around 20nm, the one in surface layer was around 100nm. The lowest volume resistivity of conductive coating was 6.2×10−2Ω⋅cm.

Suggested Citation

  • Zhenming Chen & Shoufa Zhou & Yajun Zhang & Mengru Huang & Le Wan & Yang Li & Junjun Huang, 2019. "A NOVEL PREPARATION ROUTE FOR ELECTROLESS COPPER PLATING ON SURFACE OF CaCO3 POWDERS," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 26(05), pages 1-5, June.
    • Handle: RePEc:wsi:srlxxx:v:26:y:2019:i:05:n:s0218625x1850186x
    DOI: 10.1142/S0218625X1850186X
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