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ANNEALING TREATMENT OFZnOTHIN FILMS DEPOSITED BY SOL–GEL METHOD

Author

Listed:
  • M. SALEEM

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China)

  • L. FANG

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China)

  • Q. L. HUANG

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China)

  • D. C. LI

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China)

  • F. WU

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China)

  • H. B. RUAN

    (Department of Applied Physics, Chongqing University, Chongqing 400044, China;
    Optical Engineering Key Laboratory, Chongqing Normal University, Chongqing 400030, China)

  • C. Y. KONG

    (Optical Engineering Key Laboratory, Chongqing Normal University, Chongqing 400030, China)

Abstract

Highly transparentZnOthin films were deposited on glass substrates by using a simple and inexpensive multi-step sol–gel spin coating process. This research investigated the effects of annealing temperature in the range from 350–600°C on the microstructure, surface morphology and optical properties of thin films by using XRD, SEM and transmittance spectra. The XRD results showed that thec-axis orientation ofZnOthin films was improved with the increase of annealing temperature. The grain size increases from 16.6–19.7 nm with the increase in temperature. The transmittance spectra indicated that the transmittance and direct optical band gapEgof the films showed a decreased trend with annealing temperature. It is found that the tensile stress exist in the films, which decreases with the increase in annealing temperature up to 500°C, on further increasing the annealing temperature up to 600°C, the stress in the film changes from tensile to compressive nature.

Suggested Citation

  • M. Saleem & L. Fang & Q. L. Huang & D. C. Li & F. Wu & H. B. Ruan & C. Y. Kong, 2012. "ANNEALING TREATMENT OFZnOTHIN FILMS DEPOSITED BY SOL–GEL METHOD," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 19(05), pages 1-9.
    • Handle: RePEc:wsi:srlxxx:v:19:y:2012:i:05:n:s0218625x12500552
    DOI: 10.1142/S0218625X12500552
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