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THE OPTIMIZING CONDITIONS BY TAGUCHI METHOD FOR FABRICATING SEMI-SOLIDAl–Zn–MgALLOY SLURRY BY COOLING PLATE METHOD

Author

Listed:
  • SUNG-YONG SHIM

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwa 660-701, Jinju, Korea)

  • HYUNG-WON PARK

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwa 660-701, Jinju, Korea)

  • IN-SANG JEONG

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwa 660-701, Jinju, Korea)

  • SU-GUN LIM

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwa 660-701, Jinju, Korea)

Abstract

In order to optimize the condition for the semi-solidAl–Zn–Mgaluminium alloy fabricated by cooling plate method, the Taguchi design was used. The cooling plate method effectively separating the grains formed from the mold wall can be used to form a semi-solid material by flowing molten metal over an inclinedCuplate and casting in a mold for the near-net shape component. In Taguchi's design method, the higher signal vs noise (S/N) ratio the better. Therefore, the manufacturing conditions were arranged as a table of orthogonal arrays (L9(34)), and the influence of two factors, pouring temperature and cooling plate angle, was examined. From the observed microstructures, the grain size and aspect ratio were measured by image analyzer. The results indicated that the pouring temperature exerts the main effect on the spherical microstructures since the S/N ratio, which is the sensibility of the surrounding environment, was the highest. The optimum condition for theAl–Zn–Mgalloy was a cooling plate angle of 40° and a pouring temperature of 680°C. The grain size and aspect ratio were 70 μm and 1.3, respectively.

Suggested Citation

  • Sung-Yong Shim & Hyung-Won Park & In-Sang Jeong & Su-Gun Lim, 2010. "THE OPTIMIZING CONDITIONS BY TAGUCHI METHOD FOR FABRICATING SEMI-SOLIDAl–Zn–MgALLOY SLURRY BY COOLING PLATE METHOD," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 17(02), pages 185-188.
  • Handle: RePEc:wsi:srlxxx:v:17:y:2010:i:02:n:s0218625x10013709
    DOI: 10.1142/S0218625X10013709
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