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The Study Into the Ceramic-to-Metal Soldered Joints Interface for Al2O3 and SiO2 Materials

Author

Listed:
  • Koleňák Roman
  • Koleňáková Monika
  • Provazník Martin

    (Institute of Production Technologies, Faculty of Materials Science of Technology in Trnava, Slovak university of Technology, Bratislava, ul. J. Bottu 25, 917 24 Trnava, Slovak Republic)

  • Žúbor Peter

    (Inweld Consulting, s.r.o., Trnava)

Abstract

The conditions of joining a ceramic-metal configuration by active metal soldering using tin-based (SnTi3) alloys are presented. Active metal (Ti) was alloyed in a low concentration of 3 weight percent. The joining process was carried out in a vacuum (10-2 Pa) at a peak temperature of 860 °C with a short holding period (t = 9 min). The ceramic-metal soldered interface was examined using optical microscopy, scanning and transmission electron microscopy (SEM, TEM). The natures of the interfacial reactions and the reaction products were identified using X-ray diffraction (XRD). The thickness of reaction layers and X-ray maps of the same region were measured.

Suggested Citation

  • Koleňák Roman & Koleňáková Monika & Provazník Martin & Žúbor Peter, 2010. "The Study Into the Ceramic-to-Metal Soldered Joints Interface for Al2O3 and SiO2 Materials," Research Papers Faculty of Materials Science and Technology Slovak University of Technology, Sciendo, vol. 18(29), pages 29-37, January.
    • Handle: RePEc:vrs:repfms:v:18:y:2010:i:29:p:29-37:n:3
    DOI: 10.2478/v10186-010-0023-1
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