The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips
AbstractA case study of copper interconnect technology suggests that absorptive capacity exist in three forms: disciplinary, domain specific and encoded. Each involves different ways of managing R&D and linking internal to external research. Disciplinary absorptive capacity requires a firm to actively engage with the scientific community, while protecting domain-specific knowledge. Domain-specific absorptive capacity depends upon influencing disciplinary research at universities and consortia, then capturing domain knowledge through collaboration and hiring. As technology develops, it becomes encoded, and absorption depends increasingly upon integrating knowledge from suppliers. Hence, absorptive capacity is a multifaceted construct that is heavily shaped by the type and maturity of technology absorbed. Copyright 2009 The Author 2009. Published by Oxford University Press on behalf of Associazione ICC. All rights reserved., Oxford University Press.
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Bibliographic InfoArticle provided by Oxford University Press in its journal Industrial and Corporate Change.
Volume (Year): 18 (2009)
Issue (Month): 6 (December)
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