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Decision Analysis in Microelectronic Reliability: Optimal Design and Packaging of a Diode Array

Author

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  • Boaz Ronen

    (ELTA Electronics Industries Ltd., Ashdod, Israel)

  • Joseph S. Pliskin

    (Boston University, Boston, Massachusetts)

Abstract

This paper considers quantitative aspects in microelectronic reliability using decision analysis. In a given electronic system, a diode array (i.e., system of switches) serves as a built-in test circuit. Failure of a single component can disrupt system performance. Two failure modes are possible, short or open circuit, each resulting in different damages to the system. The decision analysis considers aspects of circuit design and packaging technology. Design involves a conventional system or one with redundancy. Important considerations are cost, total failure rate, proportion of each failure mode and malfunction costs. Three alternative packaging technologies are considered. Optimal design and packaging are determined in two alternative ways: using expected monetary costs, and using expected utility. The method and results were implemented in the Israeli electronics industry. The method has also been implemented in other areas with similar decision problems (e.g., cardiac pacemakers).

Suggested Citation

  • Boaz Ronen & Joseph S. Pliskin, 1981. "Decision Analysis in Microelectronic Reliability: Optimal Design and Packaging of a Diode Array," Operations Research, INFORMS, vol. 29(2), pages 229-242, April.
    • Handle: RePEc:inm:oropre:v:29:y:1981:i:2:p:229-242
    DOI: 10.1287/opre.29.2.229
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