IDEAS home Printed from https://ideas.repec.org/a/igg/jmmme0/v10y2020i3p24-33.html
   My bibliography  Save this article

A Statistical Approach to Three-Dimensional Shape Inspection of Micro-Solder Balls

Author

Listed:
  • Jee Hong Kim

    (Pukyong National University, Busan, South Korea)

Abstract

This article presents an optical technique for the three-dimensional (3D) shape inspection of micro-solder balls used in ball grid array (BGA) packaging, before attaching them to a board or film. This technique uses an optical source comprising spatially arranged light-emitting diodes (LEDs), and the results are derived based on the specular reflection characteristics of the BGA balls. A vision system is designed to acquire the reflected image from the micro-solder balls. For shape inspection, the locations of the LED point-light-source reflections are determined via image processing, and defects in 3D BGA shapes are detected using statistical information of the relative positions of multiple BGA balls captured in the images. Experiments were conducted to validate our proposed method, and the results revealed that it allows for simultaneous inspection of multiple BGA balls placed arbitrarily in a glass dish, without the need for precise ball-position control.

Suggested Citation

  • Jee Hong Kim, 2020. "A Statistical Approach to Three-Dimensional Shape Inspection of Micro-Solder Balls," International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME), IGI Global, vol. 10(3), pages 24-33, July.
    • Handle: RePEc:igg:jmmme0:v:10:y:2020:i:3:p:24-33
    as

    Download full text from publisher

    File URL: http://services.igi-global.com/resolvedoi/resolve.aspx?doi=10.4018/IJMMME.2020070102
    Download Restriction: no
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:igg:jmmme0:v:10:y:2020:i:3:p:24-33. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Journal Editor (email available below). General contact details of provider: https://www.igi-global.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.