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Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices

Author

Listed:
  • Arvind Chandrasekaran
  • Muthukumaran Packirisamy
  • Ion Stiharu
  • Andre Delage

Abstract

A hybrid micro-machining technique suitable for reducing surface roughness in different optical micro-systems environment is presented. In general, the Micro-Opto-Electro-Mechanical Systems (MOEMS) consist of waveguide-based devices and non-waveguide-based micro-systems. The proposed technique is suitable for both kinds of applications. This paper also presents two types of micro-machining, namely, isotropic gas phase Xenon difluoride (XeF2) pulse etching and wet anisotropic etching with Tetra Methyl Ammonium Hydroxide (TMAH), along with the mechanism of hybrid micro-machining. The influence of surface roughness on scattering loss in the two kinds of optical micro-systems has been analysed and the results are presented. The improvement in surface roughness due to the proposed technique is demonstrated by experimental characterisation of the roughness parameters using a Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM). The results indicate a clear improvement in surface roughness and the induced scattering loss due to the proposed hybrid micro-machining technique.

Suggested Citation

  • Arvind Chandrasekaran & Muthukumaran Packirisamy & Ion Stiharu & Andre Delage, 2006. "Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices," International Journal of Manufacturing Technology and Management, Inderscience Enterprises Ltd, vol. 9(1/2), pages 144-159.
    • Handle: RePEc:ids:ijmtma:v:9:y:2006:i:1/2:p:144-159
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