IDEAS home Printed from https://ideas.repec.org/a/gam/jmathe/v10y2022i2p268-d725971.html
   My bibliography  Save this article

Series Solution-Based Approach for the Interlaminar Stress Analysis of Smart Composites under Thermo-Electro-Mechanical Loading

Author

Listed:
  • Salman Khalid

    (Department of Mechanical, Robotics and Energy Engineering, Dongguk University-Seoul, 30 Pil-dong 1 Gil, Jung-gu, Seoul 04620, Korea)

  • Jaehun Lee

    (Department of Mechanical, Robotics and Energy Engineering, Dongguk University-Seoul, 30 Pil-dong 1 Gil, Jung-gu, Seoul 04620, Korea)

  • Heung Soo Kim

    (Department of Mechanical, Robotics and Energy Engineering, Dongguk University-Seoul, 30 Pil-dong 1 Gil, Jung-gu, Seoul 04620, Korea)

Abstract

This paper introduces a new loading condition considering the combined thermo-electro-mechanical coupling effect in a series solution-based approach to analyze the free-edge interlaminar stresses in smart composite laminates. The governing equations are developed using the principle of complementary virtual work. The assumed stress fields satisfy the traction-free and free-edge boundary conditions. The accurate stress states of the composite structures are acquired through the procedure of generalized eigenvalue problems. The uniform temperature is employed throughout the laminate, and the electric field loading is applied to the symmetric piezo-bonded actuators to examine the combined effect of thermal and electrical stresses on the overall deformation of smart composite laminates. It was observed that the magnitude of the peeling stresses generated by mechanical loading was reduced by the combined thermal and electric excitation loading (up to 25.3%), which in turn resulted in expanding the service life of the smart composite structures. The proposed approach is implemented on three different layup configurations. The efficiency of the current methodology is confirmed by comparing the results with the 3D finite element (FEM) solution computed by ABAQUS.

Suggested Citation

  • Salman Khalid & Jaehun Lee & Heung Soo Kim, 2022. "Series Solution-Based Approach for the Interlaminar Stress Analysis of Smart Composites under Thermo-Electro-Mechanical Loading," Mathematics, MDPI, vol. 10(2), pages 1-15, January.
  • Handle: RePEc:gam:jmathe:v:10:y:2022:i:2:p:268-:d:725971
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/2227-7390/10/2/268/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/2227-7390/10/2/268/
    Download Restriction: no
    ---><---

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Seogu Park & Jinwoo Song & Heung Soo Kim & Donghyeon Ryu, 2022. "Non-Contact Detection of Delamination in Composite Laminates Coated with a Mechanoluminescent Sensor Using Convolutional AutoEncoder," Mathematics, MDPI, vol. 10(22), pages 1-15, November.
    2. Salman Khalid & Hee-Seong Kim & Heung Soo Kim & Joo-Ho Choi, 2022. "Inspection Interval Optimization for Aircraft Composite Tail Wing Structure Using Numerical-Analysis-Based Approach," Mathematics, MDPI, vol. 10(20), pages 1-18, October.
    3. Salman Khalid & Jinwoo Song & Muhammad Muzammil Azad & Muhammad Umar Elahi & Jaehun Lee & Soo-Ho Jo & Heung Soo Kim, 2023. "A Comprehensive Review of Emerging Trends in Aircraft Structural Prognostics and Health Management," Mathematics, MDPI, vol. 11(18), pages 1-42, September.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jmathe:v:10:y:2022:i:2:p:268-:d:725971. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.