IDEAS home Printed from https://ideas.repec.org/
MyIDEAS: Login to save this article or follow this journal

Effect Of Grinding-Induced Scratch Geometry On Fracture Strength Of Plastic-Encapsulated Semiconductor Devices

  • SEONG-MIN LEE

    ()

    (Department of Material Science and Engineering, University of Incheon, 177 Dohwa-dong, Nam-ku, Incheon 402-749, South Korea)

Registered author(s):

    The fracture strength of LOC (lead-on-chip) packages was measured through three-point bending tests. Metallurgical examination shows that failure in an LOC package begins at a pre-existing flaw in the form of a scratch on the bottom surface of the plastic-encapsulated silicon chip. The flexural strength of LOC packages was estimated as a function of the geometry of the grinding-induced scratches on the back surface of the chips. The major conclusion is that the fracture strength of the plastic package, including the silicon chip, can be enhanced up to 80% by changing its scratch marks from 0°, running parallel to its lateral direction, to 90°, running parallel to its longitudinal direction.

    If you experience problems downloading a file, check if you have the proper application to view it first. In case of further problems read the IDEAS help page. Note that these files are not on the IDEAS site. Please be patient as the files may be large.

    File URL: http://www.worldscinet.com/cgi-bin/details.cgi?type=pdf&id=pii:S0218625X10013916
    Download Restriction: Access to full text is restricted to subscribers.

    File URL: http://www.worldscinet.com/cgi-bin/details.cgi?type=html&id=pii:S0218625X10013916
    Download Restriction: Access to full text is restricted to subscribers.

    As the access to this document is restricted, you may want to look for a different version under "Related research" (further below) or search for a different version of it.

    Article provided by World Scientific Publishing Co. Pte. Ltd. in its journal Surface Review and Letters.

    Volume (Year): 17 (2010)
    Issue (Month): 03 ()
    Pages: 323-327

    as
    in new window

    Handle: RePEc:wsi:srlxxx:v:17:y:2010:i:03:p:323-327
    Contact details of provider: Web page: http://www.worldscinet.com/srl/srl.shtml

    Order Information: Email:


    No references listed on IDEAS
    You can help add them by filling out this form.

    This item is not listed on Wikipedia, on a reading list or among the top items on IDEAS.

    When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:17:y:2010:i:03:p:323-327. See general information about how to correct material in RePEc.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: (Tai Tone Lim)

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If references are entirely missing, you can add them using this form.

    If the full references list an item that is present in RePEc, but the system did not link to it, you can help with this form.

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your profile, as there may be some citations waiting for confirmation.

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    This information is provided to you by IDEAS at the Research Division of the Federal Reserve Bank of St. Louis using RePEc data.