Geographic Localization of Knowledge Spillovers as Evidenced by Patent Citations
The authors compare the geographic location of patent citations with that of the cited patents as evidence of the extent to which knowledge spillovers are geographically localized. They find that citations to domestic patents are more likely to be domestic and more likely to come from the same state and SMSA as the cited patents, compared with a 'control frequency' reflecting the preexisting concentration of related research activity. These effects are particularly significant at the local (SMSA) level. Localization fades over time but only very slowly. There is no evidence that more 'basic' inventions diffuse more rapidly than others. Copyright 1993, the President and Fellows of Harvard College and the Massachusetts Institute of Technology.
Volume (Year): 108 (1993)
Issue (Month): 3 (August)
|Contact details of provider:|| Web page: http://mitpress.mit.edu/journals/|
|Order Information:||Web: http://mitpress.mit.edu/journal-home.tcl?issn=00335533|
Please report citation or reference errors to , or , if you are the registered author of the cited work, log in to your RePEc Author Service profile, click on "citations" and make appropriate adjustments.:
- Jeffrey I. Bernstein & M. Ishaq Nadiri, 1988.
"Interindustry R&D Spillovers, Rates Of Return, and Production In High-Tech Industries,"
NBER Working Papers
2554, National Bureau of Economic Research, Inc.
- Bernstein, Jeffrey I & Nadiri, M Ishaq, 1988. "Interindustry R&D Spillovers, Rates of Return, and Production in High-Tech Industries," American Economic Review, American Economic Association, vol. 78(2), pages 429-34, May.
- Jeffrey Bernstein & Ishaq Nadiri, 1988. "Interindustry R&D Spillovers, Rates of Return, and Production in High-Tech Industries," Carleton Industrial Organization Research Unit (CIORU) 88-01, Carleton University, Department of Economics.
- Carpenter, Mark P. & Narin, Francis, 1983. "Validation study: Patent citations as indicators of science and foreign dependence," World Patent Information, Elsevier, vol. 5(3), pages 180-185.
This item is featured on the following reading lists or Wikipedia pages:
When requesting a correction, please mention this item's handle: RePEc:tpr:qjecon:v:108:y:1993:i:3:p:577-98. See general information about how to correct material in RePEc.
For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: (Anna Pollock-Nelson)
If references are entirely missing, you can add them using this form.