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An Aggregated Optimization Model for Multi-Head SMD Placements

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Author Info

  • Ashayeri, J.
  • Ma, N.
  • Sotirov, R.

    (Tilburg University, Center for Economic Research)

Abstract

In this article we propose an aggregate optimization approach by formulating the multi-head SMD placement optimization problem into a mixed integer program (MIP) with the variables based on batches of components. This MIP is tractable and effective in balancing workload among placement heads, minimizing the number of nozzle exchanges, and improving handling class. The handling class which specifies the traveling speed of the robot arm, to the best of our knowledge, has been for the first time incorporated in an optimization model. While the MIP produces an optimal planning for batches of components, a new sequencing heuristics is developed in order to determine the final sequence of component placements based on the outputs of the MIP. This two-stage approach guarantees a good feasible solution to the multi-head SMD placement optimization problem. The computational performance is examined using real industrial data.

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Bibliographic Info

Paper provided by Tilburg University, Center for Economic Research in its series Discussion Paper with number 2010-46.

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Date of creation: 2010
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Handle: RePEc:dgr:kubcen:201046

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Web page: http://center.uvt.nl

Related research

Keywords: Multi-head surface mounting device; Component placement; Variable placement speed;

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