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Experimental Observations Of Orderly Structures In Copper Films Deposited On Liquid Substrates

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Author Info
MIAO-GEN CHEN () (Department of Physics, China Jiliang University, Hangzhou 310018, China)
SEN-JIANG YU (Department of Physics, China Jiliang University, Hangzhou 310018, China)
YUAN-XIN FENG (College of Science, Zhejiang University of Science and Technology, Hangzhou 310023, China)
ZHI-WEI JIAO (Department of Physics, China Jiliang University, Hangzhou 310018, China)
BO YANG (Department of Physics, Zhejiang University, Hangzhou 310027, China)
Abstract

In this paper, an optical microscopy study of orderly structures, namely bands, which are observed in a nearly free sustained copper (Cu) film system, is presented. The band is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L. This study shows that the morphologies of the Cu films are very susceptible to the deposition rate, i.e. with the increase in the deposition rate f, the bands with rectangular domains first become irregular gradually and then disappear completely. The experiment indicates that the growth mechanism of the orderly patterns can be explained in terms of the relaxation of the internal stress in the films, which is related to the characteristic boundary condition of the films on the liquid substrates and the nearly zero adhesion of the solid–liquid interface.

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Publisher Info
Article provided by World Scientific Publishing Co. Pte. Ltd. in its journal Surface Review and Letters.

Volume (Year): 16 (2009)
Issue (Month): 03 ()
Pages: 359-365
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Handle: RePEc:wsi:srlxxx:v:16:y:2009:i:03:p:359-365

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Related research
Keywords: Orderly structure; thin film; liquid substrate; internal stress; 62.40.+i; 68.55.-a; 68.90.+g;

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